Enhanced Thermal Pad Composites Using Densely Aligned MgO Nanowires
- 주제(키워드) thermal pad composite , thermal conductivity , aligned MgO nanowire , thermal application
- 발행기관 고려대학교 대학원
- 지도교수 이인환
- 발행년도 2024
- 학위수여년월 2024. 2
- 학위명 석사
- 학과 대학원 신소재공학과
- 세부전공 신소재공학전공
- 원문페이지 77 p
- 실제URI http://www.dcollection.net/handler/korea/000000278444
- UCI I804:11009-000000278444
- DOI 10.23186/korea.000000278444.11009.0000386
- 본문언어 영어
초록/요약
Owing to the increasing demand for the miniaturization and high density integration of electronic devices, thermal interface materials (TIMs) are crucial components for removing heat and improving the lifetime and safety of electronic devices. Among these, thermal pads are reusable alternatives to thermal paste-type TIMs; however, conventional thermal pads comprise a homogeneous polymer with low thermal conductivity. Composite materials of thermally conducting fillers and polymer matrices are considered suitable alternatives to high-performance pad materials owing to their controllable thermal properties. However, they degrade the thermal performance of the filler materials at high loading ratios via aggregation. In this study, we propose novel nanocomposites using densely aligned MgO nanowire fillers and polydimethylsiloxane (PDMS) matrices. The developed nanocomposites ensured the enhanced thermal conducting properties, while maintaining mechanical flexibility. The three-step preparation process involves the (i) fabrication of the MgO structure using a freeze dryer; (ii) compression of the MgO structure; and (iii) the infiltration of PDMS in the structure. The resulting aligned composites exhibited a superior thermal conductivity (approximately 1.18 W/mK) to that of pure PDMS and composites with the same filler ratios of randomly distributed MgO fillers. Additionally, the MgO/PDMS composites exhibited adequate electrical insulating properties, with a room-temperature resistivity of 7.92 × 1015 Ω∙cm.
more목차
CHAPTER 1. INTRODUCTION 1
CHAPTER 2. BACKGROUND RESEARCH 4
2.1 Trends of Electronic Devices 4
2.2 Thermal Interface Materials 8
2.3 Fabrication of Three-dimensional Structure 11
CHAPTER 3. EXPERIMENTAL PROCEDURE 15
3.1 Materials 15
3.2 Fabrication of Mg(OH)2 Nanowires 16
3.3 Fabrication of Densely Aligned MgO Structures 17
3.4 Modification of MgO Structures 18
3.5 Fabrication of MgO/PDMS Composites 19
3.6 Characterizations 20
CHAPTER 4. RESULTS AND DISCUSSION 21
4.1 Process Optimization 21
4.1.1 Optimization of Mg(OH)2 nanowire 21
4.1.2 Effect of MgO hydrolysis 23
4.1.3 Fabrication process of 3D Mg(OH)2 structure 25
4.2 Densely Aligned MgO Structure 27
4.2.1 Compression process 27
4.2.2 Heat treatment optimization 33
4.3 Surface Interfacial Connection 37
4.4 Enhancement of Composite Materials 41
4.4.1 Thermal conductivity 41
4.4.2 Practical demonstrations 46
4.4.3 Electrical & Mechanical properties 52
CHAPTER 5. CONCLUSIONS 55
REFERENCES 56
