Electrical modeling of ball grid array packages based on one-port S-parameter measurement for electrical evaluation of high-speed test board : Electrical modeling of ball grid array packages based on one-port S-parameter measurement for electrical evaluation of high-speed test board
Electrical modeling of ball grid array packages based on one-port S-parameter measurement for electrical evaluation of high-speed test board
- 주제(키워드) Packaging , Capacitances , Inductances , Circuit modeling
- 발행기관 한국물리학회
- 발행년도 2005
- 총서유형 Journal
- UCI G704-001115.2005.5.3.009
- KCI ID ART000950674
- 본문언어 영어
초록/요약
To electrically characterize ball grid array (BGA) packages, one-portS-parameter measurements have been performed.Equivalent circuit parameters using theC and T models are extracted from measuredS-parameters for three dierent frequencyranges. The accuracy of two selected equivalent circuits is evaluated by comparison between the re-calculatedS11 using the extractedequivalent circuit parameters and measuredS-parameters. The results show that the T lumped model can be used to representS-parameters of BGA packages without distributed elements up to 2 GHz..
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