The improvement of adhesion between electroless copper plating and epoxy by decreasing Si diffusion using epoxy / polysulfone system
- 주제(키워드) epoxy , Si diffusion , polysulfone , Semi-IPN
- 발행기관 고려대학교 대학원
- 지도교수 윤호규
- 발행년도 2018
- 학위수여년월 2018. 2
- 학위구분 석사
- 학과 대학원 신소재공학과
- 원문페이지 50 p
- 실제URI http://www.dcollection.net/handler/korea/000000079367
- 본문언어 영어
- 제출원본 000045932353
초록/요약
Thermoplastic resin and Epoxy System were used to reduce Si diffusion, which confirmed that Si diffusion can be effectively reduced. Amin-based hardeners (M-tolidine, DDM, MXDA) were used to increase the reaction rate between epoxy and hardener and to avoid the use of additional solvents. Polysulfone with high Tg was used for the thermoplastic resin. Dichloromethane, which has a boiling point lower than the curing temperature, was used as a solvent to dissolve the polysulfone. The addition of high polysulfone in the sample preparation confirmed that solidification of polysulfone proceeded faster than epoxy hardening after blending. In case of using Epoxy / hardener with low curing temperature, the curing proceeds in the mixing process before the dispersion is properly performed. When the mixing does not proceed properly, it is confirmed that the Tg is divided into two by the incompatibility between the resin and epoxy. Blended additives through Epoxy / Polysulfone System were characterized by Differential Scanning Calorimeter(DSC) and Dynamic Mechanical Analysis(DMA). The improvement of Tg was confirmed. Si diffusion was analyzed by Energy Dispersive X-ray Spectroscopy(EDX) component analysis and the amount of diffusion was effectively reduced.
more목차
ABSTRACT iv
LIST OF TABLES vii
LIST OF FIGURES vii
1. INTRODUCTION 1
2. EXPERIMENTAL
2-1. Raw Materials 7
2-2. Sample preparation 9
2-3. Measurement
2-3-1. Thermal properties 14
2-3-2. Component analysis 15
2-3-3. Peel Strength 16
3. RESULTS AND DISCUSSION
3-1. Si diffusion and peel strength of PF-EL 17
3-2. Thermal properties 21
3-3. Component analysis 31
3-4. Peel Strength 36
4. CONCLUSIONS 40
REFERENCES 41
